JPS6118864B2 - - Google Patents
Info
- Publication number
- JPS6118864B2 JPS6118864B2 JP796879A JP796879A JPS6118864B2 JP S6118864 B2 JPS6118864 B2 JP S6118864B2 JP 796879 A JP796879 A JP 796879A JP 796879 A JP796879 A JP 796879A JP S6118864 B2 JPS6118864 B2 JP S6118864B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- board
- mounting
- substrate
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012530 fluid Substances 0.000 claims description 6
- 239000007767 bonding agent Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 14
- 239000007788 liquid Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 229910001338 liquidmetal Inorganic materials 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- -1 Freon Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP796879A JPS5599752A (en) | 1979-01-25 | 1979-01-25 | Structure for fitting ic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP796879A JPS5599752A (en) | 1979-01-25 | 1979-01-25 | Structure for fitting ic chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5599752A JPS5599752A (en) | 1980-07-30 |
| JPS6118864B2 true JPS6118864B2 (en]) | 1986-05-14 |
Family
ID=11680254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP796879A Granted JPS5599752A (en) | 1979-01-25 | 1979-01-25 | Structure for fitting ic chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5599752A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63317400A (ja) * | 1987-06-19 | 1988-12-26 | 尾池工業株式会社 | 転写シ−ト |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165659A (en) * | 1979-06-11 | 1980-12-24 | Fujitsu Ltd | Semiconductor device |
| JP3756168B2 (ja) * | 2004-03-19 | 2006-03-15 | 株式会社ソニー・コンピュータエンタテインメント | 回路の発熱制御方法、装置およびシステム |
| US7348665B2 (en) * | 2004-08-13 | 2008-03-25 | Intel Corporation | Liquid metal thermal interface for an integrated circuit device |
-
1979
- 1979-01-25 JP JP796879A patent/JPS5599752A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63317400A (ja) * | 1987-06-19 | 1988-12-26 | 尾池工業株式会社 | 転写シ−ト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5599752A (en) | 1980-07-30 |
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